发明名称 Manufacturing method of semiconductor apparatus and semiconductor apparatus, power converter using the same
摘要 In a manufacturing method of a SOI type high withstand voltage semiconductor device formed on a support substrate via an insulation film, a small-sized semiconductor device having small dispersion of withstand voltage is manufactured by introducing impurities into the whole surface of a p-type or n-type SOI substrate having an impurity concentration of 2E14 cm<SUP>-3 </SUP>or less and serving as an active layer of the semiconductor device with an ion implantation method and thereby forming a drift layer.
申请公布号 US2008265331(A1) 申请公布日期 2008.10.30
申请号 US20080103921 申请日期 2008.04.16
申请人 SAKANO JUNICHI;HARA KENJI;SHIRAKAWA SHINJI;ARAI TAIGA;MORI MUTSUHIRO 发明人 SAKANO JUNICHI;HARA KENJI;SHIRAKAWA SHINJI;ARAI TAIGA;MORI MUTSUHIRO
分类号 H01L29/00;H01L21/00 主分类号 H01L29/00
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