发明名称 |
Manufacturing method of semiconductor apparatus and semiconductor apparatus, power converter using the same |
摘要 |
In a manufacturing method of a SOI type high withstand voltage semiconductor device formed on a support substrate via an insulation film, a small-sized semiconductor device having small dispersion of withstand voltage is manufactured by introducing impurities into the whole surface of a p-type or n-type SOI substrate having an impurity concentration of 2E14 cm<SUP>-3 </SUP>or less and serving as an active layer of the semiconductor device with an ion implantation method and thereby forming a drift layer.
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申请公布号 |
US2008265331(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20080103921 |
申请日期 |
2008.04.16 |
申请人 |
SAKANO JUNICHI;HARA KENJI;SHIRAKAWA SHINJI;ARAI TAIGA;MORI MUTSUHIRO |
发明人 |
SAKANO JUNICHI;HARA KENJI;SHIRAKAWA SHINJI;ARAI TAIGA;MORI MUTSUHIRO |
分类号 |
H01L29/00;H01L21/00 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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