发明名称 METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM
摘要 In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
申请公布号 WO2006081004(B1) 申请公布日期 2008.10.30
申请号 WO2005US45729 申请日期 2005.12.16
申请人 LAM RESEARCH CORPORATION;LOHOKARE, SHRIKANT, P.;BAILEY, ANDREW, D, III 发明人 LOHOKARE, SHRIKANT, P.;BAILEY, ANDREW, D, III
分类号 H05H1/24;C23C14/00;H05K9/00 主分类号 H05H1/24
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