METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM
摘要
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
申请公布号
WO2006081004(B1)
申请公布日期
2008.10.30
申请号
WO2005US45729
申请日期
2005.12.16
申请人
LAM RESEARCH CORPORATION;LOHOKARE, SHRIKANT, P.;BAILEY, ANDREW, D, III