PAD AND CIRCUIT BOARD, ELECTRONIC DEVICE USING SAME

摘要

A pad for soldering a lead of an electronic element includes a solder portion and one or more non-contiguous extending portions. The solder portion is configured for positioning the lead of the electronic element thereon and has a size and shape substantially equal to the size and shape of the footprint of the lead. The one or more non-contiguous extending portions extending from the solder portion and configured for providing additional solder paste in the soldering process. The pad can limit the position of the leads of the electronic element in the solder portion, thus ensuring accurate positioning of the electronic element.