ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME

摘要

An exemplary assemblable substrate for an SIP includes a substrate and a group of welding pads. The substrate defines a receiving portion therein for receiving a line of pins of the SIP. The group of welding pads is formed on the substrate for electrically coupling the line of pins to the substrate; the group of welding pads being distributed around the receiving portion, two welding pads corresponding to two adjacent pins in the same line being distributed on opposing sides of the receiving portion.