<p>A thermal interface material (1) comprises a bulk polymer (2) within which is embedded sub-micron (c. 200 to 220nm) composite material wires (3) having Ag and carbon nanotubes ("CNTs") 4. The CNTs are embedded in the axial direction and have diameters in the range of 9.5 to 10nm and have a length of about 0.7µm. In general the pore diameter can be in the range of 40 to 1200 nm. The material (1) has particularly good thermal conductivity because the wires (3) give excellent directionality to the nanotubes (4) - providing very low resistance heat transfer paths. The TIM is best suited for use between semiconductor devices (e.g. power semiconductor chip) and any type of thermal management systems for efficient removal of heat from the device.</p>
申请公布号
WO2008129525(A1)
申请公布日期
2008.10.30
申请号
WO2008IE00047
申请日期
2008.04.23
申请人
UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK;RAZEEB, KAFIL, M.;ROY, SAIBAL;ROHAN, JAMES, FRANCIS;NAGLE, LORRAINE, CHRISTINE