SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same simultaneously achieving a low assembling height and low warping of a package.

SOLUTION: In a semiconductor device 40, a semiconductor element 10 is mounted on one side of a wiring substrate 17 constituted by an insulating layer 21 and wiring layers 18 and 20. The semiconductor device 40 includes a metal post 24 provided on the one side of the wiring substrate 17 on which the semiconductor element 10 is mounted, and a sealing layer 14 provided on the one side of the wiring substrate 17 on which the semiconductor element 10 is mounted so as to cover the semiconductor element 10 and expose only an opposite side of a side of the metal post 24 contacting with the wiring substrate 17.

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