STRUCTURE AND PROCESS TO PREVENT PEELING OF REACTION PRODUCT IN SEMICONDUCTOR DEVICE MANUFACTURE

摘要

The peeling of a reaction product deposition film (50) is prevented, reducing the particle contamination of a material to be treated (16) by roughening the surfaces (adhesion preventing surfaces) of an outer liner (40) and inner liner (42) both made of aluminum installed as an adhesion preventing plate inside a chamber of a plasma etching device to a surface roughness within a constant range without carrying out alumite treatment.