CLEANING COMPOSITION FOR REMOVING RESIDUES FROM PLASMA ETCH

摘要

A cleaning composition for removing the residues from plasma etch includes aqueous citric acid/citrate buffer solution, fluoride, macromolecule anti-corrosion, antifreezer and solvent. The cleaning composition may clean the residues from plasma etch, and has low etch rate for a nonmetal and metal substrate, such as Si, SiO2, tetraethylorthosilicate (PETEOS), low dielectric material, Ti, Al and Cu.