发明名称 FLEXIBLE COPPER-CLAD LAMINATE
摘要 A copper-clad laminate is provided to improve flex resistance and folding endurance while not decreasing tensile strength and elongation by adjusting coefficient of elasticity and rigidity of the polyimide system resin layer. At least one side of a copper-clad laminate comprises a polyimide system resin layer with 3.0~6.0GPa of coefficient of elasticity and 0.6~1.2g/cm of stiffness. Folding endurance by the JIS C6471 measurement method is 200 times or greater. Flex resistance by IPC-TM-650 2.4.3 measurement method is 5,000 times or greater. The thickness the polyimide resin layer is 10~40micrometers, and the thickness copper foil layer is 5~40micrometers.
申请公布号 KR20080096123(A) 申请公布日期 2008.10.30
申请号 KR20070041138 申请日期 2007.04.27
申请人 KOLON INDUSTRIES, INC. 发明人 KIM, SANG KYUN;KIM, KYUNG JONG;JEONG, SUNG CHUL;KIM, JI SUNG;PARK, JONG MIN
分类号 B32B15/08;B32B15/04 主分类号 B32B15/08
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