| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device for surface mounting which can prevent overflow of solder between external terminals of the electronic device, or between pads of a circuit board. <P>SOLUTION: The electronic device 100 for surface mounting is provided with a base board 10, provided with external terminals 15 for surface mounting on an outer surface and comprising an insulating material, and groove parts 13 formed around the external terminals 15 on a surface to be mounted on a printed board. The base board 10 is constituted of a resin substrate, containing thermosetting resin and the groove part 13, is formed by thermal processing or mechanical processing. The base board 10 is constituted of a ceramic substrate, the groove part 13 is formed by pressing or punching, and then printing the external terminals 15 by metallizing ink. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
