| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a device having an adhesive film for die bonding attached on a rear face without degrading quality of the device. SOLUTION: The manufacturing method of the device includes a step of cutting from a rear face of a wafer 2 along an expected split line by a cutting blade 421b to form a cut groove with an uncut part thinner than a finished thickness of the device left on a surface, a step of grinding the rear face of the wafer to the finished thickness of the device to leave the cut groove on the rear face, a film attaching step of attaching the adhesive film to the rear face of the wafer, a wafer supporting step of sticking a part of the wafer on the side of the adhesive film where the film is attached to a surface of a dicing tape, a wafer cutting step of cutting from the front face of the wafer along the expected split line by the cutting blade to cut the uncut part, to split the wafer into individual devices and also to cut the adhesive film, and an adhesive film separation step of expanding the dicing tape to separate the adhesive film per device. COPYRIGHT: (C)2009,JPO&INPIT
|
