发明名称 FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system where each substrate can be easily charged/discharged, and further, productive efficiency can be improved. SOLUTION: In the film deposition system 10 provided with: a chamber 11 into which a film deposition material gas can be introduced; and a pair of discharge electrodes provided inside the chamber 11 and composed of substrate arrangement electrodes 14 at which substrates 13 can be arranged and counter electrodes 21 oppositely arranged almost parallel to the substrate arrangement electrodes 14, the substrate arrangement electrodes 14 and the counter electrodes 21 are alternately arranged inside the chamber 11, the counter electrodes 21 are composed as grounding electrodes, and further, low frequency alternating voltage of 100 kHz to 2 MHz can be applied to the substrate arrangement electrodes 14. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008261010(A) 申请公布日期 2008.10.30
申请号 JP20070104712 申请日期 2007.04.12
申请人 ULVAC JAPAN LTD 发明人 JINBO YOSUKE;WAKAMATSU TEIJI;SAITO KAZUYA;ASARI SHIN;KIKUCHI MASASHI;ETO KENJI;OKAYAMA TOMOHIKO;NAKAMURA KYUZO
分类号 C23C16/505 主分类号 C23C16/505
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