| 摘要 |
A semiconductor device package ( 10 ) with a substantially rectangular shape comprising: a die attach pad ( 12 ) having a top surface and a bottom surface; a plurality of contact pads ( 26 i- 26 n) provided in at least four rows that correspond to the rectangular shape of the package, each contact pad having a top surface and a bottom surface; at least two tie bars ( 18 ) for supporting the die attach pad until the singulation of the package during manufacturing thereof the tie bars having a top surface and a bottom surface and extending from the die attach pad towards a corner of the package; -a semiconductor die ( 20 ) mounted on the top surface of the die attach pad ( 12 ) and having bonding pads ( 44 ) formed thereon; a plurality of electrical connections between selected ones of the bond pads ( 44 ) and corresponding ones of the contact pads ( 26 i- 26 n); an encapsulation encapsulating the semiconductor die ( 20 ), the top surface of the die attach pad ( 12 ), the electrical connections, the top surface of the tie bars ( 18 ) and the top surfaces of the contact pads ( 26̂2 On), and leaving the bottom surface of the die attach pad and the bottom surface of the contact pads exposed; characterized in that, at least one strip ( 30 ) having a top surface and a bottom surface is disposed between the die attach pad ( 12 ) and a corresponding row of contact pads, the strip having at least one lateral part ( 36 ) that is connected to at least one of the contact pads in said row, electrical connections being provided between the strip and selected bond pads ( 44 ) on the semiconductor die ( 20 ) adjacent to the strip.
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