发明名称 HEAT DISSIPATING SILICONE GREASE COMPOSITIONS
摘要 A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
申请公布号 US2008269084(A1) 申请公布日期 2008.10.30
申请号 US20080059138 申请日期 2008.03.31
申请人 SHIN -ETSU CHEMICAL CO., LTD. 发明人 MATSUMOTO NOBUAKI;YAMADA KUNIHIRO;MIYOSHI KEI;SAKURAI IKUO;ISOBE KENICHI
分类号 C10M105/76 主分类号 C10M105/76
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