发明名称 |
HEAT DISSIPATING SILICONE GREASE COMPOSITIONS |
摘要 |
A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
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申请公布号 |
US2008269084(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20080059138 |
申请日期 |
2008.03.31 |
申请人 |
SHIN -ETSU CHEMICAL CO., LTD. |
发明人 |
MATSUMOTO NOBUAKI;YAMADA KUNIHIRO;MIYOSHI KEI;SAKURAI IKUO;ISOBE KENICHI |
分类号 |
C10M105/76 |
主分类号 |
C10M105/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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