发明名称 |
Printed circuit board and manufacturing method thereof |
摘要 |
A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.
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申请公布号 |
US2008264687(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20080007127 |
申请日期 |
2008.01.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK KWANG-SOO;YOU DONG-SAM;KIM BONG-SOO;CHONG MYUNG-GUN;BYUN DAE-JUNG |
分类号 |
H05K3/00;H05K1/00;H05K1/03 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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