| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress deformation and distortion of a gas supply member and stably process a substrate by keeping a shower plate at optional temperature and improving uniformity of in-plane temperature. <P>SOLUTION: The plasma processing apparatus 1 is used to house a substrate W in a processing container 2 and process the substrate W by plasma which is changed from a processing gas. A gas supply member 50 for supplying a processing gas is arranged in the processing container 2, and a heat medium passage 55 is formed inside the gas supply member 50 to distribute a heat medium, and then passage change-over mechanisms 70 and 71 are provided to change over the distribution direction of the heat medium in the heat medium passage 55. The distribution direction of the heat medium is alternately changed over, thus preventing the deflection of temperature at the inlet and outlet sides of the heat medium in the gas supply member 50. <P>COPYRIGHT: (C)2009,JPO&INPIT |
