| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that an Au ball for wire-bonding bulges out of an electrode due to the inclination of the center line of a laser diode from that of an eyelet by an influence of the accuracy of an assembling apparatus in a mounting state to a package, where a sub-mount and a semiconductor chip are adhered to the eyelet. <P>SOLUTION: An electrode pattern for wire bonding includes a wire-bonding reference pattern, and a wire-bonding recognition pattern. A distance between the wire-bonding reference pattern and a wire-bonding position and a distance between the wire-bonding recognition pattern and the wire-bonding position are set to be predetermined values. <P>COPYRIGHT: (C)2009,JPO&INPIT |
