发明名称 MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM FOR TAB, AND PREPREG
摘要 It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustion The invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.
申请公布号 US2008268237(A1) 申请公布日期 2008.10.30
申请号 US20080164952 申请日期 2008.06.30
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 YONEZAWA KOJI;SHIBAYAMA KOICHI;FUSHIMI MASAO;TAKAHASHI HIDEYUKI;TANIGUCHI KOJI;YAGI MOTOHIRO
分类号 H01B3/00;B32B15/08;C08K3/34;C08K7/00;H01B3/30;H01B3/40;H01L23/14;H05K1/03 主分类号 H01B3/00
代理机构 代理人
主权项
地址