发明名称 |
MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM FOR TAB, AND PREPREG |
摘要 |
It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustion The invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.
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申请公布号 |
US2008268237(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20080164952 |
申请日期 |
2008.06.30 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
YONEZAWA KOJI;SHIBAYAMA KOICHI;FUSHIMI MASAO;TAKAHASHI HIDEYUKI;TANIGUCHI KOJI;YAGI MOTOHIRO |
分类号 |
H01B3/00;B32B15/08;C08K3/34;C08K7/00;H01B3/30;H01B3/40;H01L23/14;H05K1/03 |
主分类号 |
H01B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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