发明名称 |
METHOD OF FORMING WIRING OF LIGHT EMITTING DEVICE, SUBSTRATE FOR MOUNTING LIGHT EMITTING DEVICE, DISPLAY, BACK LIGHT, ILLUMINATING APPARATUS AND ELECTRONIC APPLIANCE |
摘要 |
A method of forming a wiring of a light emitting device having an electrode on a light emission surface is disclosed. The method includes: forming the electrode nearly in a linear shape in which the width is narrower than the light emission surface; and forming a wiring that is connected to the electrode nearly in a linear shape in which the width is narrower than the light emission surface to cross the electrode. |
申请公布号 |
US2008265744(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20070866714 |
申请日期 |
2007.10.03 |
申请人 |
SONY CORPORATION |
发明人 |
DOI MASATO |
分类号 |
H01J1/02;H01J9/02;H01L33/06;H01L33/32;H01L33/38;H01L33/54;H01L33/56 |
主分类号 |
H01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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