发明名称 METHOD OF FORMING WIRING OF LIGHT EMITTING DEVICE, SUBSTRATE FOR MOUNTING LIGHT EMITTING DEVICE, DISPLAY, BACK LIGHT, ILLUMINATING APPARATUS AND ELECTRONIC APPLIANCE
摘要 A method of forming a wiring of a light emitting device having an electrode on a light emission surface is disclosed. The method includes: forming the electrode nearly in a linear shape in which the width is narrower than the light emission surface; and forming a wiring that is connected to the electrode nearly in a linear shape in which the width is narrower than the light emission surface to cross the electrode.
申请公布号 US2008265744(A1) 申请公布日期 2008.10.30
申请号 US20070866714 申请日期 2007.10.03
申请人 SONY CORPORATION 发明人 DOI MASATO
分类号 H01J1/02;H01J9/02;H01L33/06;H01L33/32;H01L33/38;H01L33/54;H01L33/56 主分类号 H01J1/02
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