| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing device in which change in surface temperature of a polishing pad in a wafer polishing process can be reduced. <P>SOLUTION: In the wafer polishing device 100, a wafer W is pressed against a polishing pad 14 and polished while an abrasive agent is supplied onto the polishing pad 14. The wafer polishing device 100 includes: a polishing head 18 which pushes the wafer W onto the polishing pad 14; a retainer ring 22 of which the bottom surface is located closer to the polishing pad 18 than to the polishing surface of the wafer W and which can be attached to and removed from the polishing head 18 in such a manner as to surround the outer circumference of the wafer W, the retainer ring 22 including a groove 22a for flowing a cooling liquid as a temperature adjusting medium; and a second cooling mechanism 24 which supplies the cooling liquid to a flow path 23 formed by the groove 22a when the retainer ring 22 is attached to the polishing head 18. <P>COPYRIGHT: (C)2009,JPO&INPIT |
