发明名称 MOUNTING STRUCTURE, ELECTRO-OPTICAL DEVICE, INPUT DEVICE, METHOD OF MANUFACTURING MOUNTING STRUCTURE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure, an electro-optical device, an input device, a method of manufacturing the mounting structure, and electronic equipment with the mounting structure, capable of improving connection reliability of a board and a circuit board on the front and rear surfaces of the board. SOLUTION: A connecting terminal portion 14A arranged at a first face 5A, and a connecting terminal portion 30A arranged at a region which does not overlap a region which faces a first flexible circuit board 3A in a second face 5B, are provided. And a smooth face 30H is provided in a region which overlaps the first flexible circuit board 3A in the second face 5B of the board 5 in plan view. Thereby, when the connecting terminal portion 14A and the first flexible circuit board 3A are pressed and bonded, the connecting terminal portion 30A and the end of a first wiring for a heater 41 are not pinched between pressure bonding heads 50, 51, and a smooth face 5H can be pressed and bonded by the pressure bonding head 50. Therefore, the board 5 and the first flexible circuit board 3A can be pressed with a uniform force, and connection reliability of the connecting terminal portion 14A at the first face 5A side of the board 5 and the first flexible circuit board 3A can be improved. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008263161(A) 申请公布日期 2008.10.30
申请号 JP20070300177 申请日期 2007.11.20
申请人 EPSON IMAGING DEVICES CORP 发明人 YAMADA KAZUYUKI
分类号 H05K1/14;G09F9/00;H05K1/11 主分类号 H05K1/14
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