发明名称 Complex polishing pad and method for making the same
摘要 The present invention relates to a complex polishing pad and method for making the same. The method of the invention comprises the steps of: (a) providing a buffer layer, the buffer layer being continuous-porous material and having a surface; (b) flattening the surface of the buffer layer to form a flattened surface; and (c) disposing a polishing layer on the flattened surface so as to form the complex polishing pad, wherein the polishing layer is used to polish a polishing workpiece. Whereby, the complex polishing pad of the invention has a better flatness, and the buffer layer and the polishing layer have a stronger combination.
申请公布号 US2008268227(A1) 申请公布日期 2008.10.30
申请号 US20070790961 申请日期 2007.04.30
申请人 发明人 FENG CHUNG-CHIH;YAO I-PENG;WANG LYANG-GUNG;HUNG YUNG-CHANG
分类号 B32B3/00;B05D5/00 主分类号 B32B3/00
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