发明名称 |
Thermally Disappearing Resin Particle |
摘要 |
It is an object of the present invention to provide a thermally disappearing resin particle and a thermally disappearing hollow resin particle which can be decomposed at a low temperature in a short time and do not cause deformation or cracking of a sintered body to be obtained in the case of using as a binder for a ceramic or a lightening material; a method of producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and fired at a low temperature in a short time and gives a molded body with a high porosity without deformation or cracking even in the case a large quantity of a pore-forming material is used; and a method of producing a porous ceramic filter. The present invention is directed to a thermally disappearing resin particle, which contains a polyoxyalkylene resin, and 10% by weight or more of the whole particle disappearing within an hour by heating at a prescribed temperature in a range from 100 to 300° C.
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申请公布号 |
US2008269394(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20050886721 |
申请日期 |
2005.12.13 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
OOMURA TAKAHIRO;NAGATANI NAOYUKI;INAOKA MIKI;YAMAUCHI HIROSHI |
分类号 |
C08K3/22;C08G59/00;C08K3/28 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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