| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding die for transfer molding capable of controlling uniformly the amount and pressure of a resin when resin-molding a semiconductor device with a simple configuration of the molding die. SOLUTION: In the molding die for transfer molding, a predetermined resin thickness is formed by filling a resin into a cavity 5, thereafter performing a die closing operation to press a spring 12 of a movable clump part 10, and further transferring a movable cavity block 16 closely to an upper die 3 to diminish the volume of the cavity 5. COPYRIGHT: (C)2009,JPO&INPIT |
