发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable resin composition curable without using a conventionally used heavy metal-containing catalyst, and having a crosslinkable reactive silicon group in the molecule. SOLUTION: The moisture-curable resin composition comprises 0.1-20 pts.mass of an alkali metal salt (B) of a polyvalent fluoro-compound based on 100 pts.mass of a curable resin (A) having a crosslinkable reactive silicon group in the molecule. Preferably, the resin composition further contains 0.01-30 pts.mass of an amine compound (C) based on 100 pts.mass of the curable resin (A), and the amine compound (C) is preferably an aminosilane compound (C1) having an amino group and a crosslinkable reactive silicon group in the molecule. The moisture-curable resin composition can be prepared without using the conventionally used heavy metal-containing catalyst by using the alkali metal salt of the polyvalent fluoro-compound which has been considered to have no catalytic activity on the reactive silicon group. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008260933(A) 申请公布日期 2008.10.30
申请号 JP20080071523 申请日期 2008.03.19
申请人 KONISHI CO LTD 发明人 NOMURA YUKIHIRO;SATO SHINICHI;ENDO TAKESHI
分类号 C08L101/10;C08K3/24;C08K5/17;C08K5/5445 主分类号 C08L101/10
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