发明名称 |
INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM |
摘要 |
An integrated circuit hard mask processing system is provided including providing a substrate having an integrated circuit; forming an interconnect layer over the integrated circuit; applying a low-K dielectric layer over the interconnect layer; applying a hard mask layer over the low-K dielectric layer; forming a via opening through the hard mask layer and the low-K dielectric layer to the interconnect layer; applying a first fluid and a second fluid in the via opening for removing an overhang of the hard mask layer; depositing an interconnect metal in the via opening; and chemical-mechanical polishing the interconnect metal and the ultra low-K dielectric layer.
|
申请公布号 |
US2008265409(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20070739595 |
申请日期 |
2007.04.24 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD.;INFINEON TECHNOLOGIES NORTH AMERICA CORP.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LIU WUPING;BECK MICHAEL;FITZSIMMONS JOHN A. |
分类号 |
H01L23/48;H01L21/4763 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|