发明名称 LIGHT-EMITTING ELEMENT PACKAGE AND LIGHT SOURCE APPARATUS USING THE SAME
摘要 A light-emitting element package including a heat conductive layer having a first surface and a second surface, a dielectric layer disposed on the first surface of the heat conductive layer and having an opening exposing the heat conductive layer, two electrodes disposed on the dielectric layer at a side far away from the heat conductive layer, a light-emitting element, and a transparent sealing layer. The light-emitting element is disposed in the opening, carried on the first surface of the heat conductive layer, and electrically coupled to the two electrodes. The transparent sealing layer encapsulates the light-emitting element, the heat conductive layer, and the two electrodes, and exposes part of the two electrodes and the second surface of the heat conductive layer.
申请公布号 US2008265271(A1) 申请公布日期 2008.10.30
申请号 US20070962127 申请日期 2007.12.21
申请人 BIAR JIN-CHYUAN;HUANG CHIH-KUNG;HWANG JUE E-YIN 发明人 BIAR JIN-CHYUAN;HUANG CHIH-KUNG;HWANG JUE E-YIN
分类号 H01L23/34;H01L33/48;H01L33/62;H01L33/64 主分类号 H01L23/34
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