| 发明名称 |
METHOD OF CHARACTERISING A PROCESS STEP AND DEVICE MANUFACTURING METHOD |
| 摘要 |
<p>Method of Characterizing a Process Step and Device Manufacturing Method A system in which deformation of a substrate wafer is monitored during processing of the wafer is disclosed. The distortion in the substrate wafer is measured after each exposure and processing step by comparing the position of a plurality of reference marks 20 to values in a database.</p> |
| 申请公布号 |
SG146428(A1) |
申请公布日期 |
2008.10.30 |
| 申请号 |
SG20040024170 |
申请日期 |
2004.05.06 |
| 申请人 |
ASML NETHERLANDS B.V. |
发明人 |
REUHMAN-HUISKEN, MARIA ELISABETH;DE MOL, CHRISTIANUS GERARDUS MARIA;TOLSMA, HOITE PIETER THEODOOR |
| 分类号 |
G03F9/00;G03F7/20;H01L21/027;(IPC1-7):G03F7/20 |
主分类号 |
G03F9/00 |
| 代理机构 |
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