Resin substrate and manufacturing method thereof, and camera module having the same and manufacturing method thereof

摘要

The present invention relates to a resin substrate capable of improving the connectivity of a camera module having the resin substrate and reducing manufacturing time and cost of the camera module by improving the structure of the resin substrate, a manufacturing method thereof, a camera module having the same and a manufacturing method thereof. Provided are a resin substrate including a substrate body formed a plurality of connection holes on a lateral surface thereof and equipped with lateral pads into the connection holes; and a blocking member installed on a top surface of the substrate body and closing top opening portions of the connection holes, a manufacturing method thereof, a camera module having the same and a manufacturing method thereof.