SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

摘要

A substrate cleaning apparatus and substrate cleaning method are provided to remove foreign material attached at the edge portion of the substrate without polishing the substrate itself. A substrate cleaning apparatus comprises a junction unit(32) for jointing an edge portion(E) of a substrate(W) and a junction member, an elevating unit for holding and moving up and down the substrate. The junction member consists of an elastic material having the coefficient of elasticity of 0.3MPa to 2.7MPa. The junction member consists of an elastic material including silica.