发明名称 EPOXY RESIN ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin adhesive composition whose adhesive strength can be controlled. SOLUTION: The epoxy resin adhesive composition comprises a hydrocarbon compound, as an additive, which has an aromatic ring and has a total carbon number forming the aromatic ring of 6-18 and a total carbon number forming a fatty chain of 2-10. The epoxy resin adhesive composition has the correlation of linear function between the amount of the additive and the tensile shear stress with a coefficient of determination of≥0.95, and thus, the peel strength can be designed, namely, adhesive strength can be controlled, and accordingly, a peeling treatment can be carried out by applying optimal stress, without the treatment with heat, acid, alkali, water or the like, and without breaking an adherend. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008260789(A) 申请公布日期 2008.10.30
申请号 JP20070102372 申请日期 2007.04.10
申请人 AICA KOGYO CO LTD 发明人 HISATSUNE KUNIHIRO
分类号 C09J163/00;C09J11/06 主分类号 C09J163/00
代理机构 代理人
主权项
地址