发明名称 PROCESS FOR MEASURING BOND-LINE THICKNESS
摘要 A process for measuring the thickness of an insulating material. The process includes providing a device used to measure capacitance, and electrically connecting the capacitance measuring device to a heat sink and an electrical, heat-generating component. The thickness of the insulating material is determined by measuring the capacitance of the insulating material according to the formula; <?in-line-formulae description="In-line Formulae" end="lead"?>B=epsilon<SUB>r</SUB>epsilon<SUB>0</SUB>A/C, <?in-line-formulae description="In-line Formulae" end="tail"?> where B is the thickness of the insulating material, C is the capacitance, A is the area of the heat generating component, epsilon<SUB>0 </SUB>is the permittivity of free space and epsilon<SUB>r </SUB>is the relative dielectric constant of the insulating material.
申请公布号 US2008265867(A1) 申请公布日期 2008.10.30
申请号 US20070739897 申请日期 2007.04.25
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GAYNES MICHAEL A.;YARMCHUK EDWARD J.
分类号 G01N27/02 主分类号 G01N27/02
代理机构 代理人
主权项
地址