SUCTION PAD FOR SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a semiconductor package handling device, and more particularly, to a suction pad suitable (100) for sucking and holding a semiconductor package (1) more efficiently. The present invention includes a body (110) having an air suction hole (131) and at least one soft sealing member configured to be flexibly deformed according to a surface contour of a suction target, the at least one soft sealing member sealing a suction space (5) communicating with the air suction hole (131).