| 摘要 |
Semiconductor die ejecting equipment is provided to reduce a manufacturing cost and simplify a structure thereof by applying a driving method which changes the rotational motion into leveling motion. Die ejecting equipment comprises a driving motor(120), a cam(180), a lifting member(150), a piston block(155), a rotation piece(174), and a sensor. The driving motor rotates a driving shaft(122). The cam is joined with the driving shaft. The lifting member moves up/down by the rotational motion of cam. The piston block is connected with the lifting member and includes an ejector pin at the upper part thereof. The rotation piece is joined with the driving shaft in order to sense a rotation angle of the driving shaft. The sensor senses whether the rotation piece passes through.
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