Electronic component and method for manufacturing the same

摘要

A method of manufacturing an electronic component includes the steps of: a) forming a plurality of wiring boards (100, 200; 300) that include first through holes (101A, 20 1 A; 301 A) penetrating through a semiconductor substrate and conductive material (104, 204; 305) buried in the first through holes; b) providing conductive projections (107; 310) on the conductive material of any of the plurality of wiring boards; and c) bonding the plurality of wiring boards to each other and electrically connecting the conductive material of the respective wiring boards by the projections.