| 摘要 |
A bake apparatus for manufacturing semiconductor devices is provided to prevent the pattern failure in a bake process by removing the step difference between the center part and the edge part of a wafer. A bake apparatus for manufacturing semiconductor devices includes a wafer in which a deposition process, an etching process, and a polishing process are performed; the hot plate(104) which the wafer is settled on, and is bent so that the center and edge portion of wafer is adhered closely; a heater installed at the lower part of hot plate(102) in order to maintain the same interval as center and edge portion of wafer. The heater is classified into 3 zones having the different heights. A guide(106) for guiding the seating position of wafer on the top of the hot plate is protruded.
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