Ultra thin image sensing chip package

摘要

An ultra thin image sensing chip package (10) includes an image sensing chip (12) and a flexible and optically transparent film (14). The chip (12) has an image sensor (18) and a plurality of electrical conductive pads (20). The flexible and optically transparent film (14) includes a transparent window (26), and a pattern of conductors (30) formed on a surface thereof and around the transparent window. The film (14) wraps the chip (12) in such a way that the transparent window (26) corresponds to the image sensor (18) of the chip, a sealed space (60) is formed between the transparent window (26) and the image sensor(18), one end (32) of each of the conductors (30) of the film (14) bonds to each of the electrical conductive pads (20) of the chip (12), and the other end (34) of each of the conductors (30) of the film (14) is opened so as to electrically connect with other electrical elements.