| 摘要 |
<p>Provided are an IC sorter, a method for sorting a burn-in IC, an IC sorted using the method. The IC sorter according to one embodiment of the present invention includes a board table onto which a burn-in board is loaded, a tray loader and a tray unloader which are spaced from the board table in a first axis direction and extended parallel to each other in a second axis direction, a DC test buffer and unloading buffer which are spaced from the board table in a second axis direction with a working area of the board table in between, a sorting unit spaced from the board table, having at least one DC failure tray receiving ICs which fail a DC test and at least one sorting tray, a DC failure/loading head movable at least among a working location of the tray loader, the DC test buffer and a DC failure tray of the sorting unit, a unloading head movable at least among a working location of the tray unloader and the unloading buffer, a sorting head movable at least among the unloading buffer and the sorting tray of the sorting unit; and an insertion/removal head movable at least among the DC test buffer, the working area of the board table, and the unloading buffer.
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