LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package is provided to improve the thermal conductivity of lead frame by reducing the length of lead frame in which the light emitting diode is mounted. A light emitting diode package comprises a mold(10) having a cavity at the center thereof. An opened radiation window is formed on one surface of the mold to reflect the light. A lead frame(50) comprising at least one couple of lead terminals in order to be mounted at a PCB(Printed Circuit Board) is formed on the other surface of the mold. Some part of lead frame is contained in the mold. The part of lead frame in the mold is bent to be exposed to the outside.