| 摘要 |
A semiconductor device including a fuse box and a manufacturing method thereof are provided to increase the reliability and throughput of a device by suppressing the failure of repair process while blowing a fuse. A fuse box of a semiconductor device comprises a substrate(20); a fuse(21A) which is formed on the substrate and a lower edge thereof is exposed by undercut; a fuse protection layer(25A) covering the side wall of fuse and the lower edge of fuse; and an insulating layer covering the fuse. The height of fuse protection layer is greater than that of fuse.
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