RESIN SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE HAVING THE SAME AND MANUFACTURING METHOD THEREOF

摘要

A resin substrate for a camera module and a manufacturing method thereof, and the camera module including the resin substrate and a manufacturing method thereof are provided to prevent contamination in advance by a thermosetting adhesive of a side pad connected by an external terminal in side mode, thereby improving connectability with the external terminal through the side pad. A plurality of connection holes(111a) is formed in the side of a resin substrate(110). And the resin substrate includes a substrate body(111) in which a side pad(111b) is equipped in the connection hole and a closing member(112) closing the top opening of the connection hole. At this time, a plurality of epoxy resins and copper foil are laminated to manufacture the substrate body. A plurality of upper side pads(111c) for electrically connecting with the image sensor is formed on the upper side of the substrate body.