发明名称 |
Method of manufacturing an optoelectronic module and optoelectronic module obtained by the method |
摘要 |
<p>First and third conductive connecting paths are cut through the through opening (53) of a first molding (20) to electrically insulate a first light source circuit from the components of a lead frame accessible outside the first molding. The first light source circuit is connected to the exterior only through a second photoreceptor circuit () to protect the light source circuit from electrostatic discharge. The contact pads of first and second circuits are electrically connected to corresponding uncovered pads of some conductive paths of the lead frame.</p> |
申请公布号 |
EP1986236(A1) |
申请公布日期 |
2008.10.29 |
申请号 |
EP20070150134 |
申请日期 |
2007.12.19 |
申请人 |
EM MICROELECTRONIC-MARIN SA |
发明人 |
KAYAL, ABDUL-HAMID;GRANDJEAN, ANDRE |
分类号 |
H01L31/0203;H01L25/16 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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