<p>The device (10) has a transport device (6) with a supply side (6A) for supplying a workpiece (2) and a removing side (6C) for removing the workpiece to and/or from a tool (11) e.g. drill. A holding device (4) is used for holding the workpiece during machining by the tool in a machining plane that lies in a machining zone (B), and for transport of the workpiece from the supply side to the removing side. A buffer zone (A) and/or a removing zone (C) overlap in sections with the machining zone in a projection perpendicular to a transport plane or the machining plane. An independent claim is also included for a method for machining a workpiece.</p>
