| 摘要 |
A semiconductor device includes: a plurality of stacked semiconductor chips including a first semiconductor chip having a side surface, and a second semiconductor chip stacked on the first semiconductor chip; and a sealing resin placed between the plurality of semiconductor chips, at least one edge of the first semiconductor chip is positioned on an inner side of the second semiconductor chip, and the sealing resin placed between the first semiconductor chip and the second semiconductor chip is extended over the side surface of the first semiconductor chip. |
