发明名称 Manufacturing method for base piece made to adhere to adhesive sheet, manufacturing method for semiconductor wafer and manufacturing method for semiconductor device
摘要 A first adhesive sheet is made to adhere to glass in plate form, and after that, the glass is cut with a blade so as to be separated into a number of glass pieces. A second adhesive sheet is made to adhere to the surfaces of glass pieces on the side opposite to the surface to which the first adhesive sheet is made to adhere. The first adhesive sheet is peeled from the glass pieces. The first adhesive sheet is peeled in the state where glass chips that have been created in the process for cutting the glass adhere to the first adhesive sheet, and therefore, most of the glass chips which adhere to the first adhesive sheet are removed with the respective glass pieces in the state of adhering to the second adhesive sheet not being scattered.
申请公布号 US7438780(B2) 申请公布日期 2008.10.21
申请号 US20050149520 申请日期 2005.06.09
申请人 SHARP KABUSHIKI KAISHA 发明人 UCHIDA KENJI
分类号 B29C65/50;H01L27/14;B29C65/02;B29C65/54;B29C65/56;B32B37/12;B32B37/14;B32B37/16;B44C1/00;H01L21/02;H01L21/033;H01L21/48;H01L21/68;H01L21/8247;H01L23/02;H01L27/115;H01L27/146;H01L27/148;H01L31/0203;H01L31/18 主分类号 B29C65/50
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