发明名称 |
Apparatus and method for testing conductive bumps |
摘要 |
An apparatus and method for testing conductive bumps are provided. An exemplary embodiment of a bump testing unit comprises a support substrate with two probes protruding one surface thereof. A digital detecting device is embedded in the support substrate, comprising a first and second input terminals and an output terminal, wherein the input terminals electrically connects one of the probes.
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申请公布号 |
US7439751(B2) |
申请公布日期 |
2008.10.21 |
申请号 |
US20060527696 |
申请日期 |
2006.09.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO, LTD. |
发明人 |
KUO YIAN-LIANG;LIN YU-CHANG;LIN YU-TING |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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