| 摘要 |
A memory module includes a memory chip MC 1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC 3 disposed at a position not opposite to the memory buffer via the module substrate, and a memory chip MC 11 disposed at a position opposite to the memory chip MC 3 via the module substrate. A branch point at which a wiring part connected to the memory chip MC 1 and a wiring part connected to the memory chips MC 3 and MC 11 are branched is positioned at the memory buffer side from the viewpoint of the intermediate point between the planar mounting position of the memory buffer and the planar mounting position of the memory chips MC 3 and MC 11 . Accordingly, the wiring length of the wiring part can be made sufficiently short.
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