Stacked multiple electronic component interconnect structure

摘要

A stacked multiple electronic component interconnect structure includes a connector portion having a first and second connector surfaces. A first double sided land grid array having a first surface provided with a first plurality of connector units and a second surface provided with a second plurality of connector units, is positioned on the first connector surface. A second double sided land grid array having a first surface provided with a first plurality of connector units and a second surface provided with a second plurality of connector units is positioned on the second connector surface. A first electronic component is mounted to the second surface of the first land grid array and a second electronic component is mounted to the second surface of the second land grid array to form a stacked multiple electronic component interconnect structure that conserves space on an electronic board.