发明名称 APPARATUS FOR TREATING SUBSTRATES
摘要 An apparatus for treating substrates is provided to perform a supply of a substrate to processing units and an output of the substrate processed in the processing units at the same position by one conveyance unit, thereby enabling the conveyance unit to convey the substrate in a reciprocating motion. A conveyance unit(8) conveys a substrate linearly in a reciprocating motion in a horizontal direction. A loader unit(2) is disposed in a side of the conveyance unit and to supply the substrate which is not processed. A cleaning unit(11) cleans the substrate, which is supplied from the loader unit and is not processed by the conveyance unit, with a processing solution. A humidity processing unit(21) moisturizes the substrate with a processing solution before the substrate, which is not processed, is supplied to the cleaning unit. A drying unit(22) injects gas to the substrate to dry the substrate when the substrate processed in the cleaning unit is carried out to the loader unit by the conveyance unit. An unloader unit(3) is disposed in the other side of the conveyance unit and stores the substrate processed in the drying unit.
申请公布号 KR20080093376(A) 申请公布日期 2008.10.21
申请号 KR20080034535 申请日期 2008.04.15
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 NISHIBE YUKINOBU;FUSE YOICHI;NAKATSUKA YASUYUKI
分类号 G02F1/13 主分类号 G02F1/13
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