| 摘要 |
A sensor system includes a thin-film sensor provided with at least one contact area on the surface thereof, and a printed circuit board provided with at least one contact pad on the surface thereof. The thin-film sensor is arranged in relation to the surface of the printed circuit board such that the surface of the thin-film sensor opposes the surface of the printed circuit board. In order to transmit sensor currents from the thin-film sensor to the printed circuit board, a conductive glue adheres to both the contact area of the thin-film sensor and to the contact pad on the surface of the printed circuit board.
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